Many friends often ask about the difference between GPS chips when they buy GPS. My brother has also searched and sorted out a copy on the Internet for your reference. Please also add to the deficiencies:

　　(1). SiRF starIIe:

　　a. LP: Low power. It is rarely used without LP. Sensitivity: - 145dBm, which still consumes power after positioning, such as HOLUX GM-210.

　　b. Xtrac V1: high sensitivity f/w, higher sensitivity than starIIe/LP, same hardware. E.g. HOLUX 270U

　　c. Xtrac V2: The V1 version is easy to drift, and the signal is close to reality, such as HAICOM's 303S, HOLUX 231, and MINI GPS

　　(2). SiRF starIII:

　　Sensitivity: - 159dBm (measured to be about - 154dBm). Although the number of built-in correlators is 220000, it may not consume more power because the manufacturing process is changed from 0.18u to 0.13u. For example, HOLUX 236, HAICOM's new Bluetooth GPS, Huantian 338, and Litai 9553

　　(3). Sony single chip solution CXD2951:

　　The third generation of SONY chips, only RF and baseband are packaged together. Sensitivity: - 152dBm.

　　(4). Nemerix NJ1006 ( RF ) + NJ1030 ( Baseband )

　　Sensitivity: - 147dBm, the king of power saving, the lithium battery of GOPASS GPT-700850AMH with this chip has 20 hours of performance.

　　(5). Evermore:

　　Taiwan's local IC has good cost performance. The HAICOM 303E with this chip has better performance than the HOLUX 270U

　　(6) RFMD：

　　Micro Devices (RFMD) is the industry's first highly integrated Bluetooth/GPS solution - RF8900, which integrates Bluetooth communication and GPS technology in a complete system. It is said that this product can reduce the size by 20% and the cost by 25% compared with similar products. It is said that RIKALINE 6033 will use this chip

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